Dual Interface Card Manufacturing Process using Flexible Bump technology
| Process | Milling | Construction Test |
Flexible Bump Dispense |
Module Implant |
| Description |
Milling for COB Make contacts |
Antenna Test |
Flexible Bump Dispense Curing 24 hours |
Press with Heat |
| Required Tool & Equipment | Milling Machine |
Milling Machine |
FBC1200 | Implant Machines |
Milling
Felixble Bump Glue Dispensing
Chip module iCOB implant
